Products

3D

3D scanners provide continuous, non-contact level measurement using dust-penetrating technology for unsurpassed bin volume accuracy. Unlike single point devices, BinMaster's 3DLevelScanners measure multiple points to detect irregular material surfaces, cone up/down conditions, or sidewall buildup. Advanced acoustics-based technology is proven to perform in powders and bulk solids contained in tanks, silos, domes, warehouses, open bins, and piles.

3DLevelScanner

Model: 3DLS M or MV

3DLevelScanner uses advanced acoustics-based technolgy and multiple point measurement to provide effective non-contact volume measurement.

3DLevelScanner for High Temperatures

Model: 3DLS HT

3DLevelScanner specifically designed for for use in challenging materials such as clinker, alumina, frac sand, and fly ash. This model operates at temperatures up to 356°F (180°C). 

3D Multiple-Scanner System

Model: MVL

This multiple-scanner system integrates two or more 3DLevelScanners to accurately measure inventory in very large bins, tanks, or silos.

Acoustic Level Sensor

Model: RL

Non-contact level sensor that provides continuous level measurement for all types of powders and solid materials.

BinCloud® Platform for Inventory Management

The BinCloud® platform is an integrated cloud foundation for data monitoring of inventory contained in bins, tanks, and silos. It enables on-site and remote workers to work via the cloud.

3D MultiVision Software

Inventory management software provides 3DLevelScanner users an easy and convenient way to monitor data from multiple bins. 

3DLevelScanner with Teflon Coating

A 3DLevelScanner designed to resist dust buildup in powdered materials that cling to the sensor and  cause performance or maintenance issues.

3D Neck Extensions

Variable length neck extensions  allow the horn assembly of the 3DLevelScanner to be easily placed in optimal position to avoid interference by internal bin structure.  

3D Mounting Flanges

Mounting plates--designed for varying vessel designs and roof angles--ensure the 3DLevelScanner is level and secure for optimum performance. 

3D Wireless Communications

Availble for both single scanner and multi-scanner systems, wireless communications for the 3DLevelScanner reduce the time and costs associated with installation. 

BinView®

Compatible with an array of BinMaster and other Modbus sensors, the web-based BinView® application allows for easy remote inventory monitoring of multiple vessels at multiple locations.